FREMONT, Calif., March 10, 2021 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) ...

Since the end of the Second World War the use of plastics has increased remarkably due to a systematic exploitation of their principal advantages, i.e. lightness, flexibility and toughness, ease of ...

A reduction of silver consumption in PV production is required on the way to terawatt scale. Given this, the time may have come for the commercialization of new copper plating technologies – doing ...

HSINCHU, Taiwan--(BUSINESS WIRE)--Mycropore Corporation Ltd., a leading Taiwan-based supplier of micro-contamination control and filtration solution provider for advanced semiconductor industry, today ...

The electroplating intermediate is a material used in the electroplating process to adjust characteristics such as grain size, gloss, thickness and plating speed. Most of them are configured as ...

Led by Professor Tony Feng Shien-Ping from the Department of Systems Engineering at CityUHK, the research team developed a novel material to address the complex metallisation challenges in the ...

Electroplating intermediates refer to a class of fine chemicals used as electroplating additives. Unlike the salt used in the plating production process, the electroplating intermediate is an additive ...

Various power electronics products are being designed every day for a range of applications. Increasingly, these projects are taking advantage of a growing trend in the printed circuit board industry: ...

A highly transparent, flexible, stretchable and patternable copper fiber heater was successfully fabricated for potential use in smart windows and other applications. The thickness of the electrospun ...