Today’s 3D integrated circuit (3D-IC) technology is the culmination of 40 years of research in universities and laboratories scattered across the globe. Beginning with dynamic random-access memory ...
A novel parallel computing framework for chemical process simulation has been proposed by researchers from the East China University of Science and Technology and the University of Sheffield. This ...
Many aspects of semiconductor design and verification have an ever-growing “need for speed” that has outpaced the performance improvements available by running on CPUs. Electronic design automation ...