LONDON--(BUSINESS WIRE)--Process Systems Enterprise (PSE), a Siemens business, today released its rebranded gPROMS Process advanced process modelling environment. Formerly known as gPROMS ...
Novel semiconductor technologies are creating complex process flows, which are needed to support the manufacturing of advanced 3D semiconductor structures. It can be helpful to model process flows, ...
Discover how this powerful open-source SPICE simulator helps you analyse and validate analog, digital and mixed-signal ...
This year will see the broad emergence of 22-nm semiconductor processes and the beginning of an era in chip design of performance scaling versus geometric scaling. At 22 nm, innovations such as ...
The big challenge of composite design is to develop a part that will satisfy geometric tolerances and performance requirements (e.g., weight, thermal and mechanical behaviors). Today, even if sizing ...
Process chain for new SMC structural simulation approach demonstrated for Spirit AeroSystems reference wing rib redesigned to use carbon fiber SMC (C-SMC). Photo Credit, all images: Simutence, ...
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