LONDON--(BUSINESS WIRE)--Process Systems Enterprise (PSE), a Siemens business, today released its rebranded gPROMS Process advanced process modelling environment. Formerly known as gPROMS ...

Nowadays, there are many interconnects in IC chips. One of the packaging goals is to connect an IC to the next level of subsystem circuitry (package substrates/print circuit boards). Mass reflow (MR) ...

Process chain for new SMC structural simulation approach demonstrated for Spirit AeroSystems reference wing rib redesigned to use carbon fiber SMC (C-SMC). Photo Credit, all images: Simutence, ...

In 2023, as part of its HyMEET strategic project, Cetim acquired a new HySPIDE TP® machine and is still working on the material, manufacturing and design of high-pressure R&D storage tanks development ...

Nullspace Inc., an engineering software company modernizing simulation software for mission-critical RF applications, today announced the newest release of its electromagnetic simulation suite.