*Please note that information about SAP‘s strategy and possible future developments is subject to change and may be changed by SAP at any time for any reason without prior notice. Check out the SAP ...
Abstract: The adoption of double-sided cooled (DSC) module packaging remains limited by fabrication complexity, despite its promise for high-power silicon carbide (SiC) applications. This work ...
This guide provides a systematic and iterative process for building a robust SAP RAP application. Each iteration builds upon the last, focusing on essential elements such as data modeling, behavior ...
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